Low-temperature low-pressure molding epoxy resin molding material "KT-17 C20"
Suitable for transfer, injection, and compression molding! Molding materials that can be formed at around 120°C.
The "KT-17C20" is an epoxy resin molding material for low-temperature, low-pressure molding that enables molding in temperature ranges that were difficult with conventional molding materials. It can be molded at around 120°C, and due to its low-pressure molding capability and high fluidity, productivity is improved without the need for a case. Additionally, since the molding pressure and temperature are low, there is no deformation or damage to the mounted components, making it suitable for the molding and sealing of mounted components that are sensitive to heat and stress. 【Features】 ■ Molding possible at around 120°C ■ Low-pressure molding capability ■ High fluidity ■ Low-temperature curing ■ Ultra-low-pressure sealing *For more details, please refer to the PDF document or feel free to contact us.
- Company：日本合成化工
- Price：Other
